AWB7225 860 - 894 mhz small-cell power amplifer module preliminary data sheet - rev 1.0 14 pin 7 mm x 7 mm x 1.3 mm surface mount module figure 1: block diagram product description the AWB7225 is a fully matched, multi-chip-module (mcm) designed for picocell, femtocell, and customer premises equipment (cpe) applications. consisting of two parallel path high linearity, high effciency power amplifers, the device meets the extremely demanding needs of small cell infrastructure architectures. designed for lte, wcdma and hsdpa air interfaces operating in the 860 mhz to 894 mhz bands, the AWB7225 delivers up to +27 dbm of lte (e-tm1.1) features ? ingap hbt technology ? -47 dbc acpr @ 610 mhz, +27 dbm ? 29.5 db gain ? high effciency ? low transistor junction temperature ? matched for a 50 ? system ? low profle miniature surface mount package; rohs compliant ? multi-carrier capability applications ? lte, wcdma, and hsdpa air interfaces ? picocell, femtocell, home nodes ? customer premises equipment (cpe) power through an external 90-degree hybrid coupler, with an acpr of -47 dbc. the device operates from a convenient +4.5 v supply and provides 29.5 db of rf gain. the AWB7225 is manufactured using an advanced ingap hbt mmic technology offering state-of-the-art reliability, temperature stability, and ruggedness. its 7 mm x 7 mm x 1.3 mm surface mount package incorporates rf matching networks optimized for output power, effciency, and linearity in a 50 v system. r f 1 i n p u t v cc1 r f 2 o u t p u t v r e f b i a s n e t w o r k m a t c h i n g n e t w o r k m a t c h i n g n e t w o r k b i a s n e t w o r k v cc 2 r f 1 o u t p u t m a t c h i n g n e t w o r k m a t c h i n g n e t w o r k r f 2 i n p u t d e t e ct o r o u t p u t p o w e r d e t e c t o r p o w e r d e t e c t o r 9 0 o h y b r i d c o u p l e r ( e x t e r n a l ) c o m b i n e d r f o u t p u t 9 0 o h y b r i d c o u p l e r ( e x t e r n a l ) r f i n p u t s o u r ce 06/2013
2 pin name description 1 v ref reference voltage 2 gnd ground 3 rf2 in rf2 input 4 v cc1 supply voltage 5 rf1 in rf1 input 6 n/c no connection 7 det out detector output 8 gnd ground 9 gnd ground 10 rf1 out rf1 output 11 v cc2 supply voltage 12 rf2 out rf2 output 13 gnd ground 14 gnd ground figure 2: pinout (x-ray top view) table 1: pin description n/c rf2 ou t rf1 in gnd 1 10 2 3 4 5 6 9 8 7 v cc1 gnd gnd gnd gnd rf2 in 14 13 12 11 v ref v cc2 gnd det out rf1 ou t preliminary data sheet - rev 1.0 06/2013 AWB7225
3 electrical characteristics table 2: absolute minimum and maximum ratings table 3: operating ranges the device may be operated safely over these conditions; however, parametric performance is guaranteed only over the conditions defned in the electrical specifcations. parameter min typ max unit comments operating frequency (f) 860 - 894 mhz supply voltage (v cc ) +3.6 +4.5 +4.65 v reference voltage (v ref ) +2.75 0 +2.85 - +2.95 +0.5 v pa "on" pa "shut down" rf output power (p out ) - +27 - dbm using external 90 ?? hybrid couplers case temperature (t c ) -40 - +85 c stresses in excess of the absolute ratings may cause permanent damage. functional operation is not implied under these conditions. exposure to absolute ratings for extended periods of time may adversely affect reliability. parameter min max unit supply voltage (v cc ) 0 +5 v reference voltage (v ref ) 0 +3.5 v rf output power (p out ) (1) - +30 dbm esd rating human body model (2) charged device model (3) class 1c class iv - - msl rating (4) tbd - junction temperature (t j ) - +150 c storage temperature (t stg ) -40 +150 c notes: (1) at output of external 90 hybrid coupler. (2) jedec js-001-2010. (3) jedec jesd22-c101d. (4) 260 c peak refow. preliminary data sheet - rev 1.0 06/2013 AWB7225
4 table 4: electrical specifcations (t c = +25 c, v cc = +4.5 v, v ref = +2.85 v, 50 ? system) notes: (1) acpr and effciency measured at 877 mhz. (2) p out = +27 dbm, using specifed external 90 ??hybrid couplers. (3) lte e-tm1.1 (10 mhz). (4) use only v cc2 (pin 11) current when calculating device junction temperature. pa ra me te r mi n ty p ma x uni t co mments ga in (2 ) -2 9.5 -d b 860 - 894 mh z acpr (1 ), (2 ), (3 ) @ 10 mh z @ 20 mh z - - -4 7 -5 7 - - db c po we r-a dded ef fi ci en cy (1 ), (2 ), (3 ) -1 3.5- % th er ma l re si st an ce - 14.5 - c/ w junc ti on to ca se qu ie sce nt cu rre nt (i cq ) -2 95 -m a re fe re nc e cu rre nt -1 0- ma th ro ug h v re f pi n leakage cu rre nt -3 10 a v cc = +5 v, v re f = 0 v ha rm on i cs (2 ) 2f o 3f o, 4f o - - -5 0 -6 0 - - db c in pu t re tu rn los s (2 ) -2 0- db ou tp ut re tu rn loss (2 ) -2 0- db p1 db - +35.5 -d bm cw to ne sp ur io us ou tp ut lev el (2 ) (a ll sp ur io us ou tp ut s) -- -6 0d bc p ou t + 27 db m in -b an d lo ad vswr < 5: 1 ou t- of -b an d l oad vsw r < 10 :1 a ppl ie s ov er al l vo lt age an d te m per at ur e oper at in g ra n ges load mi sm at ch st re ss wi th no perm an en t degr adat io n or fa il ur e (2 ) 8: 1- -v sw r v cc = +4 .5 v, p ou t = + 27 db m a ppl ie s ov er fu ll oper at in g te m per at ur e ra ng e (4 ) supply current (1 ), (2 ), (3 ) - 823 -m a total through v cc pins preliminary data sheet - rev 1.0 06/2013 AWB7225
5 application information to ensure proper performance, refer to all related application notes on the anadigics web site: http://www.anadigics.com shutdown mode the power amplifer may be placed in a shutdown mode by applying logic low levels (see operating ranges table) to the v ref voltage. figure 3: application circuit schematic 0.1u f 100uf gn d at sl ug rf in put gn d v cc 2 v re f n/ c gn d rf 1 ou t rf 1 in v cc 1 rf 2 in 2 rf ou tp ut 1000pf 4. 7k rf 2 ou t gn d de t ou t 3 4 5 6 7 9 8 14 10 11 12 13 gn d gn d v cc 2 10uf 90 o hy br id co upl er 90 o hy br id c oupl er 0.1u f v re f v cc 1 10uf 1000pf 0.1u f 47uf de t ou t 0.1u f 100 k aw b 722 5 1 note: recommended 90 hybrid couplers are murata ldj2h825m03f a062 50 50 3 4 5 6 2 1 14 6 5 2 3 preliminary data sheet - rev 1.0 06/2013 AWB7225
6 figure 4: pcb footprint preliminary data sheet - rev 1.0 06/2013 AWB7225
7 package outline figure 5: package outline - 14 pin 7 mm x 7 mm x 1.3 mm surface mount module figure 6: branding specifcation b7225 pin 1 identifier pa rt number date co de y y= y ear ww= wo rk w eek mark ing co de anadigics logo l ot number c ountr y co de preliminary data sheet - rev 1.0 06/2013 AWB7225
8 component packaging figure 7: tape & reel packaging table 5: tape & reel dimensions pa ckag e ty pe ta pe wi dt h po cke t pi tc h reel ca pa ci ty ma x reel di a 7 mm x 7 mm x 1. 3 mm 16 mm 12 mm 2500 13 " pin 1 preliminary data sheet - rev 1.0 06/2013 AWB7225
9 o rde r numb er te mp er at ure ra ng e pa cka ge d escri pt ion co mp on ent pa cka gin g aw b7 225p 8- 40 o c to +8 5 o c ro hs -c om pl ia nt 14 pi n 7 mm x 7 mm x 1. 3 mm su rf ace mo unt m odu le t ape an d r eel , 2500 pi eces per re el ordering information warning anadigics products are not intended for use in life support appliances, devices or systems. use of an anadigics product in any such application without written consent is prohibited. import ant notice anadigics, inc. 141 mount bethel road warren, new jersey 07059, u.s.a. tel: +1 (908) 668-5000 fax: +1 (908) 668-5132 url: http://www.anadigics.com anadigics, inc. reserves the right to make changes to its products or to discontinue any product at any time without notice. the product specifcations contained in advanced product information sheets and preliminary data sheets are subject to change prior to a products formal introduction. information in data sheets have been carefully checked and are assumed to be reliable; however, anadigics assumes no responsibilities for inaccuracies. anadigics strongly urges customers to verify that the information they are using is current before placing orders. preliminary data sheet - rev 1.0 06/2013 AWB7225
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